- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/321 - After-treatment
Patent holdings for IPC class H01L 21/321
Total number of patents in this class: 2377
10-year publication summary
240
|
275
|
248
|
273
|
334
|
355
|
272
|
163
|
150
|
38
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
494 |
Applied Materials, Inc. | 16587 |
176 |
International Business Machines Corporation | 60644 |
98 |
Samsung Electronics Co., Ltd. | 131630 |
71 |
GLOBALFOUNDRIES U.S. Inc. | 6459 |
66 |
CMC Materials LLC | 254 |
61 |
United Microelectronics Corp. | 3921 |
60 |
Fujimi Incorporated | 676 |
56 |
Tokyo Electron Limited | 11599 |
54 |
BASF SE | 19740 |
42 |
Versum Materials US, LLC | 591 |
41 |
Rohm and Haas Electronic Materials CMP Holdings, Inc. | 309 |
40 |
Semiconductor Manufacturing International (Shanghai) Corporation | 1764 |
38 |
Micron Technology, Inc. | 24960 |
37 |
FUJIFILM Electronic Materials U.S.A., Inc. | 270 |
36 |
Lam Research Corporation | 4775 |
32 |
Intel Corporation | 45621 |
29 |
Semiconductor Manufacturing International (Beijing) Corporation | 1019 |
25 |
Resonac Corporation | 2233 |
25 |
Cabot Microelectronics Corporation | 219 |
23 |
Other owners | 873 |